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| *Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-UPGT801 [Contents] 1. Features -------------------------------------------------------------- 2 2. Application -------------------------------------------------------------- 2 3. Absolute Maximum Ratings ----------------------------------------------- 3 4. Electro-optical Characteristics --------------------------------------------- 3 5. Soldering Profile ------------------------------------------------------------- 4 6. Outline Dimension ------------------------------------------------- 5 7. Packing -------------------------------------------------------- 5 8. Reel Packing Structure -------------------------------------------- 6 9. Precaution for Use --------------------------------------------- 7 10. Characteristic Diagram ---------------------------------------- 8 11. Reliability Test Item and Condition -------------------------- 10 Criteria for Judging the Damage ------------------------------------------ 10 Drawn by Checked by Approved by SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 1/11 - 1. Features White colored SMT package and colorless clear window Material : GaP Suitable for all SMT assembly methods ; Suitable for all soldering methods 2. Application Automotive Electric appliance Lightings SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 2/11 - 3. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg *2 (Ta=25) Value 90 30 60 5 -40 ~ +100 -40 ~ +100 Unit mW mA mA V C C *1 IFM conditions: Pulse width Tw 0.1ms, Duty ratio 1/10 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. 4. Electro-Optical Characteristics Parameter Forward Voltage Reverse Current Luminance Intensity Peak Wavelength Dominant Wavelength Spectral Bandwidth 50% Viewing Angle *2 *1 (Ta=25) Condition IF =20mA VR=5V IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA Min 1.8 12 554 Typ 2.2 17 557 562 30 120 Max 2.7 10 30 566 Unit V Symbol VF IR IV A mcd nm nm nm deg. P d 2 1/2 *1 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10%. *2 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All measurements were made under the standardized environment of SSC ** Ranks of UPGT801 Rank IV [mcd] A 12 A < 18 12 B < 18 B 12 C < 18 C 12 D < 18 D 12 E < 18 E 12 F < 18 F G 18 G < 24 18 H < 24 H 18 I < 24 I d [nm] 554 A < 556 556 B < 558 558 C < 560 560 D < 562 562 E < 564 564 F < 566 554 G < 556 556 H < 558 558 I < 560 Rank J K L M N O P Q R IV [mcd] 18 J < 24 18 K < 24 18 L < 24 24 M < 30 24 N < 30 24 O < 30 24 P < 30 24 Q < 30 24 R < 30 d [nm] 560 J < 562 562 K < 564 564 L < 566 554 M < 556 556 N < 558 558 O < 550 560 P < 562 562 Q < 564 564 R < 566 SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 3/11 - 5. Soldering Profile (1) Reflow Soldering Conditions / Profile Preliminary heat to be at maximum 150C for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (2) Lead-free solder Preliminary heating to be at maximum 220C for maximum 2 minutes. Soldering heat to be at maximum 260C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 o Soldering Times [sec] (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 300C under soldering iron. Note : In case that the soldered products are reused in soldering process, we don't guarantee the products. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 4/11 - 6. Outline Dimension Recommended Solder Pattern 2.8 2.2 0.15 0.8 1.9 0.8 Anode 1.8 1.8 Cathode Cathode Mark 2.2 1.6 3.2 2.4 1.6 ( Tolerance: 0.2, Unit: mm ) 7. Packing 1.750.1 2.00.05 4.00.1 1.55 0.05 0.220.05 3.50.1 80.1 5 1.00.1 3.10.1 2.220.1 8 11.4 0.1 180 +0 -3 2.0 0.2 LABLE 13 0.2 3.830.1 9.0 0.3 30 10 22 60 ( Tolerance: 0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 5/11 - 8. Reel Packing Structure Reel PART NUMBER : NE11021B-FA31AA RANK : (CAR) X QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Aluminum Vinyl Bag PART NUMBER : NE11021B-FA31AA RANK : (CAR) X QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE PART NUMBER : NE11021B-FA31AA c 1 TOP LED b a RANK : (CAR) X QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 6/11 - 9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 60%HR * The LED is classified to Class 3 by JEDEC (J-STD-020A and J-STD-033). (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of L/F. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 7/11 - 10. Characteristic Diagram Forward Current vs Forward Voltage (TA=25C) 100 1 .6 Relative Luminous Intensity vs. Forward Current (TA=25C) Relative Luminous Intensity IV / IV (20mA) [Rel.] 1 .8 1 .9 2 .0 2 .1 2 .2 2 .3 2 .4 1 .4 Forward Current IF [mA] 1 .2 1 .0 10 0 .8 0 .6 0 .4 1 0 .2 1 .7 0 .0 0 5 10 15 20 25 30 Forward Voltage VF (V) Forward Current IF (mA) Forward Current Derating Curve Radiation Diagram 40 (TA=25C) Forward Current IF [mA] 30 0 -30 30 20 -60 10 60 0 -60 -40 -20 0 20 40 60 80 100 120 -90 90 Ambient Temperature TA [C] SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 8/11 - Luminous Intensity vs. Ambient Temperature Relative Luminous Intensity IV / IV (25C) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 9/11 - 11. Reliability Test Item and Condition Duration / Cycle 100 Cycle 100 Cycle 2 Times 1000 Hours 1000 Hours 1000 Hours 1000 Hours 300 Hours 1000 Hours 1000 Hours 3 times Number of Damage 0/22 Item Thermal Shock Temperature Cycle Registance to Soldering Heat (Reflow Soder) High Temperature Storage High Temperature High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature High Humidity Life Test High Temperature Life Test Low Temperature Life Test ESD (HBM) Reference EIAJ ED-4701 Test Condition Ta =-40C (30MIN) ~ 100C (30MIN) Ta =-40C (30MIN) ~ 25C (5MIN) ~ 100C (30MIN) ~ 25C (5MIN) Tsld=260C, 10 Sec EIAJ ED-4701 0/22 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 Internal Reference Internal Reference Internal Reference MIL-STD883D 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/5 Ta =100C Ta =85C, RH=85% Ta =-40C Ta =25C, IF =Max Ta =85C, RH=85%, IF =Max Ta =100C, IF =Max Ta =-40C, IF =Max 1 kV at 1.5 k; 100 pF Criteria for Judging the Damage Criteria for Judgement MIN LSL*2 x 0.5 MAX USL*1 x 1.2 USL*1 x 2.0 - Item Forward Voltage Reverse Current Luminous Intensity Symbol VF IR IV Condition IF =20mA VR=5V IF =20mA Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UPGT801 - 10/11 - |
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